SC175 Packaging of Optoelectronic, Photonic and MEMS Components

Monday, March 22, 2010
9:00 a.m.–12:00 p.m.
Tolga Tekin¹,²; ¹Technische Univ. Berlin, Germany, ²Fraunhofer-Inst. fuer Zuverlaessigkeit und Mikrointegration (IZM) System Integration and Interconnection Technologies, Germany
Level: Beginner (no background or minimal training is necessary to understand course material)

Course Description

This Short Course provides an overview of the challenges, current solutions, and future trends in the development of practical photonic, optoelectronic, and MEMS component packaging. The course will cover those aspects of optics, device physics, and materials science required to understand valid packaging solutions and also to participate in the engineering of these solutions. The current art in packaging of optoelectronic components will be discussed, and examples of innovative packaging solutions that are beginning to be applied will be presented.

Benefits and Learning Objectives

This course should enable you to:

  • Determine the critical issues involved in photonic package development and their impact on manufacturing costs and component performance.
  • Appreciate how optical design of components influences packaging.
  • Identify the various materials selection alternatives for photonic packaging.
  • Describe important elements of mechanical design for successful packaging of photonic, optoelectronic and MEMS devices.
  • Identify the important electronic design issues operable in optoelectronic component packaging.
  • Discuss intelligently the details and tradeoffs involved in package design and assembly.
  • Explain the advantages and disadvantages of evolving solutions for optoelectronic and photonic component packaging.
  • Establish design strategies and work effectively toward practical and reliable solutions to challenges in photonic, optoelectronic and MEMS packaging.

Intended Audience

This course will be useful for engineers who want to broaden their understanding of packaging technology management or wish to understand the issues involved in photonic component packaging development. Entrepreneurs and venture promoters looking to find the best packaging solution for their needs will also find the course useful.

Biography

Tolga Tekin received his B.S. degree in electronics and telecommunications engineering from Istanbul Technical University in 1992, his MS degree in electrical engineering from Technical University of Berlin in 1997 and his PhD degree in electrical engineering and computer science at Technical University of Berlin in 2004. He worked as research scientist at Fraunhofer-Institut for Telecommunications Heinrich-Hertz-Institut where he focused on optical signal processing, 3R regeneration, all-optical switching, clock recovery, and integrated optics. He worked as a postdoctoral researcher at University of California on components for OCDMA and Terabit router. He worked at Teles on phased array antennas for skyDSL. He is now with Fraunhofer-Institut for Reliability and Microintegration, leading projects on optical interconnections and silicon photonics packaging.