SC175 Packaging of Optoelectronic, Photonic and MEMS Components

Monday, March 23, 2009
9:00 a.m.–12:00 p.m.
Paul Haugsjaa; Polycision Inc., USA
Level: Beginner (no background or minimal training is necessary to understand course material)

Course Description

This Short Course provides an overview of the challenges, current solutions, and future trends in the development of practical photonic, optoelectronic, and MEMS component packaging. The course will cover those aspects of optics, device physics, and materials science required to understand valid packaging solutions and also to participate in the engineering of these solutions. The current art in packaging of optoelectronic components will be discussed, and examples of innovative packaging solutions that are beginning to be applied will be presented.

Benefits and Learning Objectives

This course should enable you to:

  • Determine the critical issues involved in photonic package development and their impact on manufacturing costs and component performance.
  • Appreciate how optical design of components influences packaging.
  • Identify the various materials selection alternatives for photonic packaging.
  • Describe important elements of mechanical design for successful packaging of photonic, optoelectronic and MEMS devices.
  • Identify the important electronic design issues operable in optoelectronic component packaging.
  • Discuss intelligently the details and trade-offs involved in package design and assembly.
  • Explain the advantages and disadvantages of evolving solutions for optoelectronic and photonic component packaging.
  • Establish design strategies and work effectively toward practical and reliable solutions to challenges in photonic, optoelectronic and MEMS packaging.

Intended Audience

This course will be useful for engineers who want to broaden their understanding of packaging technology management or wish to understand the issues involved in photonic component packaging development. Entrepreneurs and venture promoters looking to find the best packaging solution for their needs will also find the course useful.

Biography

Paul Haugsjaa, a principal consultant at Polycision Inc., was the senior director of optical switching at Axiowave Networks, managed photonic and optoelectronic device development at Foster-Miller and served at GTE (Verizon) Labs as research manager for solid-state device, optoelectronic interconnects and packaging development. His interests include hybrid optoelectronic integration, alignment, optical fiber fabrication, fiber lasers, precision manufacturing techniques, and the design, fabrication, packaging and use of MEMS components in RF, photonic and biological applications.